3 new system-on-chip ease the scaling of x86 applications for developers in different industries such as industrial control and automation

Like in most other industries, Internet of Things (IoT) is one of the largest trends in the embedded industry. It brings out endless possibilities besides posing important engineering challenges for silicon makers and the customers who use embedded devices for industrial control and automation.

amd-makes-low-power-embedded-applications-scalability-easierAt this week’s Embedded World in Germany’s Nuremberg, AMD declared 3 new system-on-chip (SoC) devices which will ease catching up IoT benefits for developers. They will help developers ease x86 scalability in addition to providing more pin-compatibility and price options.

Colin Cureton, director of product management and enterprise solutions at AMD informs that as they want to connect billions of devices, up to 50 billion devices until 2020—they have to do it in a way that’s coherent and easy for people to use and increase the advantages of the Internet of Things.

Variety of IoT devices brings on a much broader range of answers necessary across the whole network. Cureton continues:  “This in turn drives a  very large order of different levels of processing requirements, different levels of GPU, CPU and I/O needs in every one of these applications and devices”.

In order to deal with this multeity, AMD has launched two 3rd-gen Embedded G-Series SoCs at the higher end of performance together with entry-level Embedded G-Series LX SoC. Lower-end LX is pin-compatible to the prior generation G-Series SoCs which was introduced three years ago; and the new better performance chips propose first-time pin compatibility for G-Series processors with the high-end AMD Embedded R-Series SoC

amd-makes-low-power-embedded-applications-scalability-easier-3Customers of AMD can scale their products with an ease up-down and sideways thanks to common package infrastructures as well as shared core architectures, thus more markets and price points is opened up for Internet of Things. For instance, with the same Jaguar Plus core as the second generation, the Embedded G-Series LX SoC rests on the same FT3 package as prior G-Series generations. It works with the identical Radeon Graphics Core Next (GCN) GPU which was scaled down with a perspective of performance, and uses the identical I/O and IP in the device.

Cureton explains that in hardware and software scalability regard, across the first and second generation, they are presently able to scale up and down the stack and the LX products. So customers with platforms based upon the G-Series SoC are able to scale down to lower levels of performance and cost, that will let them take their applications into fresh markets which may be more sensitive in terms of price.

That’s important for software and hardware developers in various sectors such as networking, gaming, military/aerospace, retail, medical imaging and more. It’s a gladly received development for industrial controls, automation as well as machine vision.

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A household customer in the industrial market has adopted their plan of action in order to develop its products across sectors more easily.

It is also the case for the customers of AMD who are attempting to move to the higher end of the range that has higher levels of power-efficiency for graphics and compute competences. These two 3rd-gen SoCs are offered in the same bundle infrastructure with 1st-gen R-Series SoC, launched in October providing a more enhanced feature set for platforms with a higher-performance. The R-Series was groundbreaking for some markets since the single-chip solution removed the controller hub as an individual component in hardware compositions.

Nextgen G-Series SoCs have the same fundamental architecture with R-Series. So first-time, there is pin compatibility between the G and R Series. Moreover the Excavator core of the 1st– gen of R-Series SoC is presently coming to the G-Series.

To sum, across the 2 families, embedded processors of AMD bear software-hardware scalability up and down their product pile. Thus, customers are able to choose from 2 scalable stacks to build solutions of their own. Moreover, they are able to choose from CPU and GPU perspective various performance points besides choosing in terms of I/O mix, needed power envelope and the price points for their products to be successful. This leads to a unique selection option with regards to choosing an AMD cpu and inter-devices migration and scalability ease. It also lets customers right-size the cpu they prefer and diminish the number of platforms they must have to build in so as to scale their systems into varied applications.

The first third-generation AMD Embedded G-Series SoCs are now accessible ready for use. Extra offerings are to be presented in the first half of the year. Initial AMD Embedded G-Series LX products are due in March.

 

 

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